Determination of thermal conductivity of epoxy resin with metallic load
Keywords:conductivity, experimental, photoacoustic, emissivity, epoxy resin
With the increase of technology in the electronics industry, new methods have emerged, resulting in smaller components and higher processing capacity. In contrast, problems related to rate of heat transfer of these components have been increasing and with this reduction in size, the temperature began to be an important variable to be observed in equipment. Normally, performance improvements, such as computers or racks of telephone exchanges, translate directly into greater heat dissipation of electronic devices that make up the device, and consequently, high rates of heat transfer. Thus, the cooling of electronic equipment gained paramount importance as the effect of increased power densities in micro-electronic equipment made available by advances in semiconductor technology. Because of this, whenever we face interesting challenges in finding a technique of removing heat more effectively for these high-tech applications, is one of those challenges, which underpin this research is to determine the properties of the constituent components of a new system cooling is a heat exchanger based on phase change of a fluid inert. There are a few examples: automotive radiator and air conditioning, cooling and optoelectronic LEDs. A heat exchanger is physically designed to enhance and to improve the surface in contact with the cooling fluid around it, like air. Approach air velocity, choice of material and surface treatment are some of the factors that influence the thermal resistance and thermal performance of these components. In this research, the epoxy resin with metallic charge, has lower thermal conductivity than aluminum, for example, however, it does not conduct electricity, getting great importance of electronic devices nowadays.